Interesting video about 7nm Chinese chips.
<https://www.youtube.com/watch?v=m9UfaY69bxA&t=372s>
According to the video, China is better than the EU and on par with the US.
Even though it got banned by the US.

It is also reported by the register
<https://www.theregister.com/2022/07/22/china_smic_7nm_chips/>
<https://web.archive.org/web/20220723223133/https://www.theregister.com/2022/07/22/china_smic_7nm_chips/>

<https://www.tomshardware.com/news/china-chipmaker-smics-7nm-process-is-reportedly-copied-from-tsmc-tech>

--
-alien-
~ Work like you don't need the money. ~
~ Love like you've never been hurt. ~
~ Dance like nobody is looking. ~

On Saturday, July 23, 2022 at 6:38:25 PM UTC-4, alien wrote:
> Interesting video about 7nm Chinese chips.
> <https://www.youtube.com/watch?v=m9UfaY69bxA&t=372s>
> According to the video, China is better than the EU and on par with the US.
> Even though it got banned by the US.
>
> It is also reported by the register
> <https://www.theregister.com/2022/07/22/china_smic_7nm_chips/>
> <https://web.archive.org/web/20220723223133/https://www.theregister.com/2022/07/22/china_smic_7nm_chips/>
>
> <https://www.tomshardware.com/news/china-chipmaker-smics-7nm-process-is-reportedly-copied-from-tsmc-tech>
>
> --
> -alien-
> ~ Work like you don't need the money. ~
> ~ Love like you've never been hurt. ~
> ~ Dance like nobody is looking. ~

A related article on China's advancement in chip making and chip making machinery.
"How China could leapfrog US chip-making bans:
US efforts to stop China from making top-end chips are being undercut by new forms of ‘advanced packaging’
....
China won’t be able to produce the 3 to 5-nanometer chips that TSMC and Samsung fabricate in their latest plans, but it may be able to package the older 14-nanometer chips into 3D configurations that achieve the same results – and at considerably lower costs.

The Biden administration’s belated attempt to suppress China’s semiconductor industry appears to have backfired. China has found workaround technologies that bypass the aging American IP that Washington has embargoed.

In 2011 China produced just 12.7% of its domestic chip consumption and imported the rest. By 2021, it produced 17% of domestic consumption and by 2030 it is expected to produce 30%.
https://asiatimes.com/2022/07/how-china-could-leapfrog-us-chip-making-bans/

I suspect the 2021 domestic produced figure of 17% is an underestimation given the
very restrictive ban against importing chip to China.

On Sunday, July 24, 2022 at 8:05:08 AM UTC+8, ltlee1 wrote:
> On Saturday, July 23, 2022 at 6:38:25 PM UTC-4, alien wrote:
> > Interesting video about 7nm Chinese chips.
> > <https://www.youtube.com/watch?v=m9UfaY69bxA&t=372s>
> > According to the video, China is better than the EU and on par with the US.
> > Even though it got banned by the US.
> >
> > It is also reported by the register
> > <https://www.theregister.com/2022/07/22/china_smic_7nm_chips/>
> > <https://web.archive.org/web/20220723223133/https://www.theregister.com/2022/07/22/china_smic_7nm_chips/>
> >
> > <https://www.tomshardware.com/news/china-chipmaker-smics-7nm-process-is-reportedly-copied-from-tsmc-tech>
> >
> > --
> > -alien-
> > ~ Work like you don't need the money. ~
> > ~ Love like you've never been hurt. ~
> > ~ Dance like nobody is looking. ~
> A related article on China's advancement in chip making and chip making machinery.
> "How China could leapfrog US chip-making bans:
> US efforts to stop China from making top-end chips are being undercut by new forms of ‘advanced packaging’
> ...
> China won’t be able to produce the 3 to 5-nanometer chips that TSMC and Samsung fabricate in their latest plans, but it may be able to package the older 14-nanometer chips into 3D configurations that achieve the same results – and at considerably lower costs.
>
> The Biden administration’s belated attempt to suppress China’s semiconductor industry appears to have backfired. China has found workaround technologies that bypass the aging American IP that Washington has embargoed.
>
> In 2011 China produced just 12.7% of its domestic chip consumption and imported the rest. By 2021, it produced 17% of domestic consumption and by 2030 it is expected to produce 30%.
> https://asiatimes.com/2022/07/how-china-could-leapfrog-us-chip-making-bans/
>
> I suspect the 2021 domestic produced figure of 17% is an underestimation given the
> very restrictive ban against importing chip to China.

The restrictive ban to sell machine to China has given rise to many developers of machines to set up abroad outside of US in order to ensure there will be a equal market for machines to drive down the pricing of new chip development and market demand for it. Also, China and people abroad are already looking at doing the chip differently with faster and cheaper way than now.. When there is an obstacle, there is way to overcome it. Therefore, the ban gives a new direction in doing things differently can aspire new new ways of doing things. It is like doing thing with no stone unturned. Doing thing differently is doing thing with different outcome.

On Saturday, July 23, 2022 at 8:05:08 PM UTC-4, ltlee1 wrote:
> On Saturday, July 23, 2022 at 6:38:25 PM UTC-4, alien wrote:
> > Interesting video about 7nm Chinese chips.
> > <https://www.youtube.com/watch?v=m9UfaY69bxA&t=372s>
> > According to the video, China is better than the EU and on par with the US.
> > Even though it got banned by the US.
> >
> > It is also reported by the register
> > <https://www.theregister.com/2022/07/22/china_smic_7nm_chips/>
> > <https://web.archive.org/web/20220723223133/https://www.theregister.com/2022/07/22/china_smic_7nm_chips/>
> >
> > <https://www.tomshardware.com/news/china-chipmaker-smics-7nm-process-is-reportedly-copied-from-tsmc-tech>
> >
> > --
> > -alien-
> > ~ Work like you don't need the money. ~
> > ~ Love like you've never been hurt. ~
> > ~ Dance like nobody is looking. ~
> A related article on China's advancement in chip making and chip making machinery.
> "How China could leapfrog US chip-making bans:
> US efforts to stop China from making top-end chips are being undercut by new forms of ‘advanced packaging’

More on 'advanced packaging'.

"If microchips were cities, the new, industrywide strategy for making them better could be summed up in one
word: sprawl. In some case, the chips inside our most powerful devices are taking up so much real estate they
hardly qualify as “micro” anymore.

One way engineers are making this happen is by piling microchips atop one another. It’s like urban infill, only
instead of building towering new apartment blocks, the usually pancake-flat tiles of silicon inside of computers
are becoming multistory, with the circuitry used for functions such as memory, power management and graphics
stacked on top of each other.
....
Making megachips is no small feat, in part because doing so means maneuvering each chip component into place
with nanoscale precision, and connecting them without the benefit of a microscopic soldering gun.

This is now possible in large part because of recent innovation in an area that has long been neglected by the chip
industry. That area is “packaging.” That’s the usually obscure step that comes after a microchip has been
manufactured, when it is connected to tiny wires and enveloped in plastic before being placed on a board, also
covered in wires, that connects it to the rest of a device.

In traditional devices, a chip that receives and transmits radio waves (say, to communicate via Wi-Fi) may connect
to another one doing general-purpose computations, and the connection between them is something literally called
a “bus.” But like its real-world equivalent, this bus is hardly a fast way to transport anything between these adjacent
silicon cities. The new packaging of megachips instead connects these two chips—and potentially many more—
directly. The result is more like putting all of these chips together under one roof, in a single high-rise.
....
The essential building block to make megachips and chip stacking happen is a new kind of microchip, called a
“chiplet.” It does away with some of the old-style circuitry to communicate more directly with other chiplets. By
creating many short, direct connections—often forged from the same silicon that the chips themselves are made
from, rather than copper or some other metal—these chiplets can be fused with other chiplets to form megachips.

Direct communication between the different chiplets that together make up a megachip is what allows them to
function like a single, giant microprocessor, ..."
https://www.wsj.com/articles/chiplet-amd-intel-apple-asml-micron-ansys-arm-ucle-11659135707

> ...
> China won’t be able to produce the 3 to 5-nanometer chips that TSMC and Samsung fabricate in their latest plans, but it may be able to package the older 14-nanometer chips into 3D configurations that achieve the same results – and at considerably lower costs.
>
> The Biden administration’s belated attempt to suppress China’s semiconductor industry appears to have backfired. China has found workaround technologies that bypass the aging American IP that Washington has embargoed.
>
> In 2011 China produced just 12.7% of its domestic chip consumption and imported the rest. By 2021, it produced 17% of domestic consumption and by 2030 it is expected to produce 30%.
> https://asiatimes.com/2022/07/how-china-could-leapfrog-us-chip-making-bans/
>
> I suspect the 2021 domestic produced figure of 17% is an underestimation given the
> very restrictive ban against importing chip to China.

On Saturday, July 30, 2022 at 8:13:39 PM UTC+8, ltlee1 wrote:
> On Saturday, July 23, 2022 at 8:05:08 PM UTC-4, ltlee1 wrote:
> > On Saturday, July 23, 2022 at 6:38:25 PM UTC-4, alien wrote:
> > > Interesting video about 7nm Chinese chips.
> > > <https://www.youtube.com/watch?v=m9UfaY69bxA&t=372s>
> > > According to the video, China is better than the EU and on par with the US.
> > > Even though it got banned by the US.
> > >
> > > It is also reported by the register
> > > <https://www.theregister.com/2022/07/22/china_smic_7nm_chips/>
> > > <https://web.archive.org/web/20220723223133/https://www.theregister.com/2022/07/22/china_smic_7nm_chips/>
> > >
> > > <https://www.tomshardware.com/news/china-chipmaker-smics-7nm-process-is-reportedly-copied-from-tsmc-tech>
> > >
> > > --
> > > -alien-
> > > ~ Work like you don't need the money. ~
> > > ~ Love like you've never been hurt. ~
> > > ~ Dance like nobody is looking. ~
> > A related article on China's advancement in chip making and chip making machinery.
> > "How China could leapfrog US chip-making bans:
> > US efforts to stop China from making top-end chips are being undercut by new forms of ‘advanced packaging’
> More on 'advanced packaging'.
>
> "If microchips were cities, the new, industrywide strategy for making them better could be summed up in one
> word: sprawl. In some case, the chips inside our most powerful devices are taking up so much real estate they
> hardly qualify as “micro” anymore.
>
> One way engineers are making this happen is by piling microchips atop one another. It’s like urban infill, only
> instead of building towering new apartment blocks, the usually pancake-flat tiles of silicon inside of computers
> are becoming multistory, with the circuitry used for functions such as memory, power management and graphics
> stacked on top of each other.
> ...
> Making megachips is no small feat, in part because doing so means maneuvering each chip component into place
> with nanoscale precision, and connecting them without the benefit of a microscopic soldering gun.
>
> This is now possible in large part because of recent innovation in an area that has long been neglected by the chip
> industry. That area is “packaging.” That’s the usually obscure step that comes after a microchip has been
> manufactured, when it is connected to tiny wires and enveloped in plastic before being placed on a board, also
> covered in wires, that connects it to the rest of a device.
>
> In traditional devices, a chip that receives and transmits radio waves (say, to communicate via Wi-Fi) may connect
> to another one doing general-purpose computations, and the connection between them is something literally called
> a “bus.” But like its real-world equivalent, this bus is hardly a fast way to transport anything between these adjacent
> silicon cities. The new packaging of megachips instead connects these two chips—and potentially many more—
> directly. The result is more like putting all of these chips together under one roof, in a single high-rise.
> ...
> The essential building block to make megachips and chip stacking happen is a new kind of microchip, called a
> “chiplet.” It does away with some of the old-style circuitry to communicate more directly with other chiplets. By
> creating many short, direct connections—often forged from the same silicon that the chips themselves are made
> from, rather than copper or some other metal—these chiplets can be fused with other chiplets to form megachips.
>
> Direct communication between the different chiplets that together make up a megachip is what allows them to
> function like a single, giant microprocessor, ..."
> https://www.wsj.com/articles/chiplet-amd-intel-apple-asml-micron-ansys-arm-ucle-11659135707
> > ...
> > China won’t be able to produce the 3 to 5-nanometer chips that TSMC and Samsung fabricate in their latest plans, but it may be able to package the older 14-nanometer chips into 3D configurations that achieve the same results – and at considerably lower costs.
> >
> > The Biden administration’s belated attempt to suppress China’s semiconductor industry appears to have backfired. China has found workaround technologies that bypass the aging American IP that Washington has embargoed.
> >
> > In 2011 China produced just 12.7% of its domestic chip consumption and imported the rest. By 2021, it produced 17% of domestic consumption and by 2030 it is expected to produce 30%.
> > https://asiatimes.com/2022/07/how-china-could-leapfrog-us-chip-making-bans/
> >
> > I suspect the 2021 domestic produced figure of 17% is an underestimation given the
> > very restrictive ban against importing chip to China.

That right, the new ways of doing things and producing more efficient outcomes are by direct circuitries that stacked on top of each other that each can be removed, readapted, reused, and exchanged. It is not in the current ways of very fine lines of lithographic circuitries to pass through them that can short circuit and bring the cost very high to replace rather than the cost of being cheap because of the fine lines of lithography by very fine laser etching of circuity packaging. Thus new machine has to be designed to make these micro processes into a highly automatic machine's operated processes.

On Saturday, July 30, 2022 at 8:13:39 AM UTC-4, ltlee1 wrote:
> On Saturday, July 23, 2022 at 8:05:08 PM UTC-4, ltlee1 wrote:
> > On Saturday, July 23, 2022 at 6:38:25 PM UTC-4, alien wrote:
> > > Interesting video about 7nm Chinese chips.
> > > <https://www.youtube.com/watch?v=m9UfaY69bxA&t=372s>
> > > According to the video, China is better than the EU and on par with the US.
> > > Even though it got banned by the US.
> > >
> > > It is also reported by the register
> > > <https://www.theregister.com/2022/07/22/china_smic_7nm_chips/>
> > > <https://web.archive.org/web/20220723223133/https://www.theregister.com/2022/07/22/china_smic_7nm_chips/>
> > >
> > > <https://www.tomshardware.com/news/china-chipmaker-smics-7nm-process-is-reportedly-copied-from-tsmc-tech>
> > >
> > > --
> > > -alien-
> > > ~ Work like you don't need the money. ~
> > > ~ Love like you've never been hurt. ~
> > > ~ Dance like nobody is looking. ~
> > A related article on China's advancement in chip making and chip making machinery.
> > "How China could leapfrog US chip-making bans:
> > US efforts to stop China from making top-end chips are being undercut by new forms of ‘advanced packaging’
> More on 'advanced packaging'.
>
> "If microchips were cities, the new, industrywide strategy for making them better could be summed up in one
> word: sprawl. In some case, the chips inside our most powerful devices are taking up so much real estate they
> hardly qualify as “micro” anymore.
>
> One way engineers are making this happen is by piling microchips atop one another. It’s like urban infill, only
> instead of building towering new apartment blocks, the usually pancake-flat tiles of silicon inside of computers
> are becoming multistory, with the circuitry used for functions such as memory, power management and graphics
> stacked on top of each other.
> ...
> Making megachips is no small feat, in part because doing so means maneuvering each chip component into place
> with nanoscale precision, and connecting them without the benefit of a microscopic soldering gun.
>
> This is now possible in large part because of recent innovation in an area that has long been neglected by the chip
> industry. That area is “packaging.” That’s the usually obscure step that comes after a microchip has been
> manufactured, when it is connected to tiny wires and enveloped in plastic before being placed on a board, also
> covered in wires, that connects it to the rest of a device.
>
> In traditional devices, a chip that receives and transmits radio waves (say, to communicate via Wi-Fi) may connect
> to another one doing general-purpose computations, and the connection between them is something literally called
> a “bus.” But like its real-world equivalent, this bus is hardly a fast way to transport anything between these adjacent
> silicon cities. The new packaging of megachips instead connects these two chips—and potentially many more—
> directly. The result is more like putting all of these chips together under one roof, in a single high-rise.
> ...
> The essential building block to make megachips and chip stacking happen is a new kind of microchip, called a
> “chiplet.” It does away with some of the old-style circuitry to communicate more directly with other chiplets. By
> creating many short, direct connections—often forged from the same silicon that the chips themselves are made
> from, rather than copper or some other metal—these chiplets can be fused with other chiplets to form megachips.
>
> Direct communication between the different chiplets that together make up a megachip is what allows them to
> function like a single, giant microprocessor, ..."
> https://www.wsj.com/articles/chiplet-amd-intel-apple-asml-micron-ansys-arm-ucle-11659135707
> > ...
> > China won’t be able to produce the 3 to 5-nanometer chips that TSMC and Samsung fabricate in their latest plans, but it may be able to package the older 14-nanometer chips into 3D configurations that achieve the same results – and at considerably lower costs.
> >
> > The Biden administration’s belated attempt to suppress China’s semiconductor industry appears to have backfired. China has found workaround technologies that bypass the aging American IP that Washington has embargoed.
> >
> > In 2011 China produced just 12.7% of its domestic chip consumption and imported the rest. By 2021, it produced 17% of domestic consumption and by 2030 it is expected to produce 30%.
> > https://asiatimes.com/2022/07/how-china-could-leapfrog-us-chip-making-bans/
> >
> > I suspect the 2021 domestic produced figure of 17% is an underestimation given the
> > very restrictive ban against importing chip to China.
Another article on advanced packaging.
https://www.chinatimes.com/realtimenews/20220729002350-260410?chdtv
扇出型封裝技術(Fan-out)現已成為未來5G、先進封裝發展之重要趨勢，日月光投控(3711)旗下半導體封測廠矽品精密搶占先機即早掌握關鍵技術，並與國內7大名校產學聯盟攜手並進，持續穩步研發與深化技術，於超級電腦領域獲得更強大高速運算之重要成果，讓優秀科技學子於先進封裝技術發展歷程貢獻一己之力，亦真正落實產學合作人才培育之意涵。
專業委外封測代工(OSAT)大廠矽品精密(SPIL)表示，長久以來累積的先進封裝實力，在近年開花結果，獲得多數客戶的讚賞與肯定。矽品從早期單晶片扇出型封裝(Fan-Out Single Die, FO-SD)，進展到多樣扇出型解決方案，目前整個系列包含FO-PoP(Package-on-Package)、FO-MCM(Multi-Chip-Module)、FO-EB(Embedded Bridge)、FO-SiP(System-in-Package)等，這些先進封裝技術可應用在旗艦級手機處理器、高速網路交換晶片與AI人工智慧處理器及穿戴裝置等不同產品領域上，讓晶片發揮更強大的系統整合效能。
矽品研發中心資深副總曾維楨指出，依據產品應用需求所開發出來的晶粒整合技術，不但提供了不同晶粒水平方向的互聯，也往垂直方向延伸，開展出多層的堆疊架構。Fan-Out的技術主要在於重佈線層(RDL)與通孔串接的能力，最終還要透過材料特性的搭配和高精度製程才能完成。矽品自2021年起攜手7所大專院校，中央大學、成功大學、逢甲大學、暨南大學、東海大學、台灣大學、交通大學等校，完成多項半導體技術合作，透過深入的技術理論基礎研究，提供產品設計參考依據，例如透過AI模型建立及智慧機台導入，除了能提供力學及電性更精準且有效率的性能預測、各製程參數資料庫分析、多種金屬介面接合反應的微結構探討，亦能提供失效機制分析及後續結構設計修正。
矽品一直著重精準的事前風險分析，透過模擬、設計、技術整合加上製程管制，以達到穩定的量產品質。因應未來3D封裝趨勢，矽品下一世代Fan-Out技術，將以FO-EB-T(TSV)平台整合3D堆疊和微細線路設計，以幫助客戶完成未來人工智能(AI)、高效能運算晶片(HPC)對先進封裝的需求，並透過產學合作，不僅契合半導體產業需求，亦真正幫助學子快速縮短學用差距，穩步厚植職場競爭力。

On Saturday, July 30, 2022 at 12:54:26 PM UTC-4, stoney wrote:
> On Saturday, July 30, 2022 at 8:13:39 PM UTC+8, ltlee1 wrote:
> > On Saturday, July 23, 2022 at 8:05:08 PM UTC-4, ltlee1 wrote:
> > > On Saturday, July 23, 2022 at 6:38:25 PM UTC-4, alien wrote:
> > > > Interesting video about 7nm Chinese chips.
> > > > <https://www.youtube.com/watch?v=m9UfaY69bxA&t=372s>
> > > > According to the video, China is better than the EU and on par with the US.
> > > > Even though it got banned by the US.
> > > >
> > > > It is also reported by the register
> > > > <https://www.theregister.com/2022/07/22/china_smic_7nm_chips/>
> > > > <https://web.archive.org/web/20220723223133/https://www.theregister..com/2022/07/22/china_smic_7nm_chips/>
> > > >
> > > > <https://www.tomshardware.com/news/china-chipmaker-smics-7nm-process-is-reportedly-copied-from-tsmc-tech>
> > > >
> > > > --
> > > > -alien-
> > > > ~ Work like you don't need the money. ~
> > > > ~ Love like you've never been hurt. ~
> > > > ~ Dance like nobody is looking. ~
> > > A related article on China's advancement in chip making and chip making machinery.
> > > "How China could leapfrog US chip-making bans:
> > > US efforts to stop China from making top-end chips are being undercut by new forms of ‘advanced packaging’
> > More on 'advanced packaging'.
> >
> > "If microchips were cities, the new, industrywide strategy for making them better could be summed up in one
> > word: sprawl. In some case, the chips inside our most powerful devices are taking up so much real estate they
> > hardly qualify as “micro” anymore.
> >
> > One way engineers are making this happen is by piling microchips atop one another. It’s like urban infill, only
> > instead of building towering new apartment blocks, the usually pancake-flat tiles of silicon inside of computers
> > are becoming multistory, with the circuitry used for functions such as memory, power management and graphics
> > stacked on top of each other.
> > ...
> > Making megachips is no small feat, in part because doing so means maneuvering each chip component into place
> > with nanoscale precision, and connecting them without the benefit of a microscopic soldering gun.
> >
> > This is now possible in large part because of recent innovation in an area that has long been neglected by the chip
> > industry. That area is “packaging.” That’s the usually obscure step that comes after a microchip has been
> > manufactured, when it is connected to tiny wires and enveloped in plastic before being placed on a board, also
> > covered in wires, that connects it to the rest of a device.
> >
> > In traditional devices, a chip that receives and transmits radio waves (say, to communicate via Wi-Fi) may connect
> > to another one doing general-purpose computations, and the connection between them is something literally called
> > a “bus.” But like its real-world equivalent, this bus is hardly a fast way to transport anything between these adjacent
> > silicon cities. The new packaging of megachips instead connects these two chips—and potentially many more—
> > directly. The result is more like putting all of these chips together under one roof, in a single high-rise.
> > ...
> > The essential building block to make megachips and chip stacking happen is a new kind of microchip, called a
> > “chiplet.” It does away with some of the old-style circuitry to communicate more directly with other chiplets. By
> > creating many short, direct connections—often forged from the same silicon that the chips themselves are made
> > from, rather than copper or some other metal—these chiplets can be fused with other chiplets to form megachips.
> >
> > Direct communication between the different chiplets that together make up a megachip is what allows them to
> > function like a single, giant microprocessor, ..."
> > https://www.wsj.com/articles/chiplet-amd-intel-apple-asml-micron-ansys-arm-ucle-11659135707
> > > ...
> > > China won’t be able to produce the 3 to 5-nanometer chips that TSMC and Samsung fabricate in their latest plans, but it may be able to package the older 14-nanometer chips into 3D configurations that achieve the same results – and at considerably lower costs.
> > >
> > > The Biden administration’s belated attempt to suppress China’s semiconductor industry appears to have backfired. China has found workaround technologies that bypass the aging American IP that Washington has embargoed.
> > >
> > > In 2011 China produced just 12.7% of its domestic chip consumption and imported the rest. By 2021, it produced 17% of domestic consumption and by 2030 it is expected to produce 30%.
> > > https://asiatimes.com/2022/07/how-china-could-leapfrog-us-chip-making-bans/
> > >
> > > I suspect the 2021 domestic produced figure of 17% is an underestimation given the
> > > very restrictive ban against importing chip to China.
> That right, the new ways of doing things and producing more efficient outcomes are by direct circuitries that stacked on top of each other that each can be removed, readapted, reused, and exchanged. It is not in the current ways of very fine lines of lithographic circuitries to pass through them that can short circuit and bring the cost very high to replace rather than the cost of being cheap because of the fine lines of lithography by very fine laser etching of circuity packaging. Thus new machine has to be designed to make these micro processes into a highly automatic machine's operated processes.

For some reason, many in the West wrongly believe that technological innovation
depends on their so called "free speech" and "free press." In reality, innovation is
often created through market. A natural result of supply and demand. Large market
is naturally more innovative because of economies of scale and scopes. For the US,
one of its problem is that companies such as INTEL are spending more effort in
lawfare than in innovation. Else, TSMC could not possibly overtake INTEL
technologically.

The US government passed the Wolf Amendment 10 years ago and the CHIPS Act
more recently. This approach to contain China is likely to fail similarly.

On Monday, August 1, 2022 at 7:57:39 PM UTC+8, ltlee1 wrote:
> On Saturday, July 30, 2022 at 12:54:26 PM UTC-4, stoney wrote:
> > On Saturday, July 30, 2022 at 8:13:39 PM UTC+8, ltlee1 wrote:
> > > On Saturday, July 23, 2022 at 8:05:08 PM UTC-4, ltlee1 wrote:
> > > > On Saturday, July 23, 2022 at 6:38:25 PM UTC-4, alien wrote:
> > > > > Interesting video about 7nm Chinese chips.
> > > > > <https://www.youtube.com/watch?v=m9UfaY69bxA&t=372s>
> > > > > According to the video, China is better than the EU and on par with the US.
> > > > > Even though it got banned by the US.
> > > > >
> > > > > It is also reported by the register
> > > > > <https://www.theregister.com/2022/07/22/china_smic_7nm_chips/>
> > > > > <https://web.archive.org/web/20220723223133/https://www.theregister.com/2022/07/22/china_smic_7nm_chips/>
> > > > >
> > > > > <https://www.tomshardware.com/news/china-chipmaker-smics-7nm-process-is-reportedly-copied-from-tsmc-tech>
> > > > >
> > > > > --
> > > > > -alien-
> > > > > ~ Work like you don't need the money. ~
> > > > > ~ Love like you've never been hurt. ~
> > > > > ~ Dance like nobody is looking. ~
> > > > A related article on China's advancement in chip making and chip making machinery.
> > > > "How China could leapfrog US chip-making bans:
> > > > US efforts to stop China from making top-end chips are being undercut by new forms of ‘advanced packaging’
> > > More on 'advanced packaging'.
> > >
> > > "If microchips were cities, the new, industrywide strategy for making them better could be summed up in one
> > > word: sprawl. In some case, the chips inside our most powerful devices are taking up so much real estate they
> > > hardly qualify as “micro” anymore.
> > >
> > > One way engineers are making this happen is by piling microchips atop one another. It’s like urban infill, only
> > > instead of building towering new apartment blocks, the usually pancake-flat tiles of silicon inside of computers
> > > are becoming multistory, with the circuitry used for functions such as memory, power management and graphics
> > > stacked on top of each other.
> > > ...
> > > Making megachips is no small feat, in part because doing so means maneuvering each chip component into place
> > > with nanoscale precision, and connecting them without the benefit of a microscopic soldering gun.
> > >
> > > This is now possible in large part because of recent innovation in an area that has long been neglected by the chip
> > > industry. That area is “packaging.” That’s the usually obscure step that comes after a microchip has been
> > > manufactured, when it is connected to tiny wires and enveloped in plastic before being placed on a board, also
> > > covered in wires, that connects it to the rest of a device.
> > >
> > > In traditional devices, a chip that receives and transmits radio waves (say, to communicate via Wi-Fi) may connect
> > > to another one doing general-purpose computations, and the connection between them is something literally called
> > > a “bus.” But like its real-world equivalent, this bus is hardly a fast way to transport anything between these adjacent
> > > silicon cities. The new packaging of megachips instead connects these two chips—and potentially many more—
> > > directly. The result is more like putting all of these chips together under one roof, in a single high-rise.
> > > ...
> > > The essential building block to make megachips and chip stacking happen is a new kind of microchip, called a
> > > “chiplet.” It does away with some of the old-style circuitry to communicate more directly with other chiplets. By
> > > creating many short, direct connections—often forged from the same silicon that the chips themselves are made
> > > from, rather than copper or some other metal—these chiplets can be fused with other chiplets to form megachips.
> > >
> > > Direct communication between the different chiplets that together make up a megachip is what allows them to
> > > function like a single, giant microprocessor, ..."
> > > https://www.wsj.com/articles/chiplet-amd-intel-apple-asml-micron-ansys-arm-ucle-11659135707
> > > > ...
> > > > China won’t be able to produce the 3 to 5-nanometer chips that TSMC and Samsung fabricate in their latest plans, but it may be able to package the older 14-nanometer chips into 3D configurations that achieve the same results – and at considerably lower costs.
> > > >
> > > > The Biden administration’s belated attempt to suppress China’s semiconductor industry appears to have backfired. China has found workaround technologies that bypass the aging American IP that Washington has embargoed.
> > > >
> > > > In 2011 China produced just 12.7% of its domestic chip consumption and imported the rest. By 2021, it produced 17% of domestic consumption and by 2030 it is expected to produce 30%.
> > > > https://asiatimes.com/2022/07/how-china-could-leapfrog-us-chip-making-bans/
> > > >
> > > > I suspect the 2021 domestic produced figure of 17% is an underestimation given the
> > > > very restrictive ban against importing chip to China.
> > That right, the new ways of doing things and producing more efficient outcomes are by direct circuitries that stacked on top of each other that each can be removed, readapted, reused, and exchanged. It is not in the current ways of very fine lines of lithographic circuitries to pass through them that can short circuit and bring the cost very high to replace rather than the cost of being cheap because of the fine lines of lithography by very fine laser etching of circuity packaging. Thus new machine has to be designed to make these micro processes into a highly automatic machine's operated processes.
> For some reason, many in the West wrongly believe that technological innovation
> depends on their so called "free speech" and "free press." In reality, innovation is
> often created through market. A natural result of supply and demand. Large market
> is naturally more innovative because of economies of scale and scopes. For the US,
> one of its problem is that companies such as INTEL are spending more effort in
> lawfare than in innovation. Else, TSMC could not possibly overtake INTEL
> technologically.
>
> The US government passed the Wolf Amendment 10 years ago and the CHIPS Act
> more recently. This approach to contain China is likely to fail similarly..

The driver of needs and demands is where the market is. China has the biggest market for products. The market demanders can dictate what they want from it. The market can demand supplier to comply with them. If not, they can exit their market from it.

Henceforth, China can dictate that the chip in the supplier's products has to be made, designed in China, and produced by Chinese workers and Chinese companies of chip designers and manufacturing machines for which the latest machines have to produced and made in China by any supplier entering into do business in China's market.